Atmel® Corporation, the renowned organization in designing and manufacturing of microcontrollers and advanced logic announced here today of the introduction of the 128K-bit Serial EEPROM device in an 8-pin ultra thin MLP (2 x 3mm) leadless package with overall height of 0.60mm. and has been claimed as the first device of such kind in the industry.

Atmel, founded in 1984, is a renowned leader in the design and manufacture of microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. The company through influencing one of the industry's broadest intellectual property (IP) technology portfolios, has been able to provide the electronics industry with complete system solutions. It is recorded as one of the minority elite new companies who are capable of incorporating dense nonvolatile memory, logic and analog functions on a single chip. The Atmel chips are manufactured through the usage of the most advanced wafer processes that includes BiCMOS, CMOS and Silicon Germanium (SiGe) technologies. It is also found to be concentrating on consumer, industrial, security, communications, computing and automotive markets.

It has come to the knowledge, that the 8-pin ultra thin MLP (2 x 3 x 0.60mm) package is offered at present in densities from 1K-bit to 128K-bit for the 2-wire Serial EEPROM (AT24) and 1K-bit to 64K-bit in the SPI Serial EEPROM (AT25) family. It has further been stated that the contemporary package has been made as an ideal device for both the compact and portable consumer applications that includes MP3 players, digital cameras and remote controls. In addition, the MLP package has been regarded as a paradigm for its extensive and commendable applications for a wide range of height constrained communication applications that includes, Bluetooth modules and mobile phones. It is to be learnt in this respect, that as part of the convention, the MLP (2 x 3mm) package has been restricted to low density Serial EEPROM devices. In consistent with the market researches Atmel is the first organization to be directly involved in the notion of promotion of this package for high-density Serial EEPROM devices up to 128K-bit. In the past, the highest available density that was thoroughly available by the industry in a 2X3 mm MLP was a 32K Serial EEPROM.

While speaking on the128K-bit Serial EEPROM device Bassam Khoury, the Managing Director for the Serial Interface Product Line said,    "Fitting a 128K-bit Serial EEPROM in an ultra thin MLP package offers designers with maximum flexibility, in board space savings and overall height, while maintaining the capability to migrate up in density from 1K-bit up to 128K-bit without changing the board layout."   "Atmel's leading edge technology enabled us to accomplish this breakthrough in package technology," he concluded.