Electro Scientific Industries, Inc, the renowned provider of world-class photonics and laser systems for micro-engineering applications, today announced here that Korean memory giant Hynix Semiconductor has placed an order for multiple ESI Model 9850 infrared (IR) laser link-processing systems. It has also been avowed, that the world's first dual-beam IR laser system, the Model 9850, has experienced rapid adoption since its introduction in the last July at SEMICON West.

It must be pointed, that the reference of this order was highlighted in ESI's third quarter earnings release symbolizing a significant milestone in the Company's expanding portfolio of innovative products. Hynix, in addition, plans to use the Model 9850 systems for high-throughput processing of its next-generation DRAM and flash memory devices.

ESI is a frontrunner and leading supplier of world-class production laser systems having the direction of aiding its microelectronics customers to attain compelling yield and productivity gains. From its commencement in 1944 the company's industry-leading, application-specific products has been engaged in concentrating and augmenting electronic-device performance in three key sectors like semiconductors, components and electronic interconnect. The aspiration has been to enable exactitude in fine-tuning of device microfeatures in high-volume manufacturing environments. Whereas Hynix Semiconductor is a frontrunner in the supply of advanced semiconductor memory products that are used in today's leading edge computing, consumer, and communications products. 

Speaking on the occasion Mr. Sok-Young Song, the Manager of test infra-engineering parts at Hynix said, “The success we have experienced with our existing ESI 9830 systems spurred our decision to select the dual-beam 9850. Our recent spate of breakthrough memory products -- including the world's fastest 200MHz 512Mb mobile DRAM and fastest 185MHz 512Mb mobile DDR SDRAM -- require equally innovative link processing. ESI's 9850 offers the high throughput and low cost of ownership we need to optimize fabrication of our most advanced devices."

Mr. Nick Konidaris, the President and CEO of ESI said, "Our dual-beam technology enables ESI to deliver unsurpassed productivity to our global customer base." "We are extremely pleased to be awarded this business from Hynix. We are committed to continue leveraging our production-proven single- and dual-beam technology to bring superior memory-repair solutions to market," he added.

In this respect it is to be mentioned, that the 9850 processes tight-pitch metal fuses on the latest generation of DRAM and NAND flash devices. Being designed to enable whole-wafer processing with half the number of link runs, the 9850 has been created for the deployment in high-throughput, automated 300mm production environments.